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Precision Rolling Lines
Rolling, slitting and dimensional control
Clad & Weld Process
Our proprietary Clad & Weld process creates metallurgically bonded bimetallic materials with superior performance characteristics.
Validation Capability
From Process Capability to Procurement Evidence
Raytron connects material selection, process control and inspection items to procurement specifications so engineering, quality and sourcing teams can align before RFQ.
| Stage | Key Checks | Evidence Buyers Should Request |
|---|---|---|
| Material and surface preparation |
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| Cladding and heat treatment |
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| Final release |
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Key Process Characteristics
Solid-State Bonding
- • No melting of base metals during the bonding process
- • Preserves the original properties of both metals
- • Creates a true metallurgical bond at the interface
High Bond Strength
- • Bond strength ≥ 60 MPa
- • Significantly higher than electroplated alternatives
- • Consistent interface quality across the entire length
Material Combinations
Copper Clad Aluminum (CCA)
Copper cladding ratio: 60%-90%
Lightweight, excellent conductivity
Copper Clad Steel (CCS)
Copper cladding ratio: 10%-40%
High strength for demanding applications
Nickel Clad Copper (NCC)
Various nickel ratios available
Corrosion resistance for harsh environments
Silver Clad Copper (SCC)
High-conductivity applications
Premium performance for precision applications
Process Declaration
All our bimetallic products are manufactured using the Clad & Weld process with metallurgical bonding, NOT electroplated. This ensures superior bond strength, durability, and performance.
Bond Strength ≥ 60 MPa
Process Visualization
Schematic Diagram
01. Cleaning
Removes oxides and impurities from raw material surfaces to ensure a clean bonding interface.
02. Bonding
Physically presses two metals together under high pressure to form an initial mechanical bond.
03. Diffusion
High-temperature annealing causes atoms to diffuse across the interface, forming a metallurgical bond.
Key Technical Parameters
| Parameter | Range | Note |
|---|---|---|
| Diffusion Temp | 800°C - 1000°C | Depends on material combo |
| Bonding Pressure | > 100 MPa | Ensures gap-free contact |
| Thickness Tolerance | ± 0.005 mm | High precision control |
FAQ
How does Clad & Weld differ from Electroplating?
Electroplating is a surface deposition process. Clad & Weld uses pressure, heat and diffusion control to form a bonded interface. Reliability should be confirmed by cross-section, peel or bond-strength testing.
Does this process affect conductivity?
The process is designed to maintain a stable conductive path, but conductivity and contact resistance should be confirmed by product form, layer ratio and customer test method.
Products Utilizing This Technology
