Bare and Tin-Plated Copper Strip
Choose the surface finish for the specified solder joint or contact system. For tin-plated strip, define the tin layer and its condition after forming, as well as the base copper grade, temper, dimensions and edge requirements.
Engineering comparison
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| Decision | Bare Copper Strip | Tin Plated Copper Strip | Acceptance basis | Your input or result |
|---|---|---|---|---|
| Surface | Copper surface of the specified finish | Tin layer over the specified copper substrate | Choose the surface required by the joint or contact system. | |
| Forming sequence | Formed copper surface needs its defined handling/cleanliness | Tin may be applied before or after forming as specified | Check coating thickness, adhesion and cracking after the intended sequence. | |
| Joining | Use the defined preparation and solder/contact process | Use the defined tin finish and solder/contact process | Tin is a process input, not a universal reliability guarantee. |
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Products and specifications
Include the drawing, intended application and acceptance criteria when requesting a comparison.
Review a strip-and-plating specification