Composite and Copper Busbar Ribbon
Compare both ribbon constructions in the same module current path, including dimensions, resistance, joint design, temperature rise and material use.
Engineering comparison
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| Decision | composite busbar ribbon | pure copper busbar ribbon | Acceptance basis | Your input or result |
|---|---|---|---|---|
| Current collection | Layered section collects current through the busbar path | Copper section collects current through the busbar path | Fix string layout, length, allowable resistance and thermal rise. | |
| Forming | Check layer integrity at bends and exposed cut edges | Check copper temper and bend geometry | Use the actual busbar width, thickness, radius and assembly restraint. | |
| Joints | Qualify solder or weld access to the specified surface layer | Qualify solder or weld on the copper grade and coating | Measure joint resistance and mechanical acceptance after the specified thermal cycles. | |
| Cost basis | Include changed section, joining and coating operations | Include copper section and joining operations | Use cost per accepted current-collection assembly. |
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Products and specifications
Include the drawing, intended application and acceptance criteria when requesting a comparison.
Compare busbar ribbon options