PV Ribbon
Interconnect Ribbon for Solar Cell Stringing
Interconnect ribbon connects cells within a PV string. Select the base material, dimensions and solder coating for the cell layout and stringer process.
Construction and specification
- Material construction
- Copper-aluminum composite or specified copper base with the coating defined by the cell process
- Product form
- Ribbon
- Surface coating
- Tin, low-temperature solder, black or reflective coating
- Thickness range
- 0.10-0.35 mm typical, custom on request
- Width range
- 0.30-2.00 mm typical, custom on request
- Supply format
- Spool, traverse wound spool or cut-to-length
Specify ribbon width and thickness, coating system, yield-strength and camber targets, spool format and stringer model. Confirm the soldering window, peel strength, resistance and module-reliability requirements before approval.
Send the cell and module drawing, process requirements and quantity for a quotation.
Standards context
Use the drawing and a material/form-specific purchase specification. Round-wire references do not qualify rolled strip, foil or flat wire. Confirm edition, methods and acceptance criteria.
Standards scope referencesProduct questions
What is interconnect ribbon?
interconnect ribbon is a solar module interconnection material used to collect and transfer current between solar cells or cell strings. Raytron supplies custom ribbon dimensions, coating systems and packaging formats for different PV module technologies.
How do I choose interconnect ribbon?
Start with the cell technology and soldering temperature. Then check coating type, shading loss, yield strength, module reliability requirements and compatibility with the automated process.
Can Raytron customize interconnect ribbon?
Yes. Width, thickness, coating, temper, spool format and packaging can be customized according to drawing, sample or module process requirements.
Prepare your inquiry
- Width, thickness and tolerances
- Edge condition, burr, surface and roll dimensions
- Core and outer-layer metals, each layer or ratio, and mass or volume basis
- Coating alloy and thickness, soldering conditions, cell layout and spool format
- Quantity, spool or coil format, packaging and delivery destination