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Tin-Plated Copper Strip RFQ Checklist

Specify the base copper, temper and finished dimensions first. Then add tin type and thickness, adhesion and solderability requirements, downstream forming or joining, and the coil format.

Copper substrate: grade, condition and dimensionsTin surface: coverage, thickness and process
Surface-layer schematic, not to scale. Confirm single- or double-sided coverage and hot-dip or electroplating process. Tin coating is separate from the conductor’s core and cladding.
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Separate base copper, plating and downstream processing

Fill in the input cells, then copy the table and paste it into your inquiry. Leave unknown items blank.

On narrow screens, scroll to see all columns.

GroupInformation to provideYour input
Base copperGrade, temper, width/thickness, tolerances, edge/burr and electrical requirement
Tin systemMatte, bright or reflowed finish as required; process/chemistry identification
Plating dimensionsThickness by face, minimum/local criteria, coverage and measurement method
AcceptanceAdhesion, solderability, aging and whisker requirements with agreed methods and limits
ProcessingStamping/bending sequence, exposed cut edges, joining and finished-part checks
SupplyCoil format, quantity, protection, labeling and inspection records

Copy before opening inquiry.

Record the trial and order basis

Keep the drawing revision, sample identifiers, method, test conditions, acceptance limits and measured results together. Resolve open fields with the specification owner before comparing offers or releasing a changed construction.

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