Web checklist
Solar Module Interconnection RFQ Checklist
Prepare the cell layout, current paths, ribbon dimensions, solder coating and stringer settings. Add the peel-strength, resistance and module-reliability criteria that will be used to compare samples.
Information to include
Copy these fields into your inquiry and add the values you know. Attach or describe the drawing through the contact page.
Fill in the input cells, then copy the table and paste it into your inquiry. Leave unknown items blank.
On narrow screens, scroll to see all columns.
| Field | What to provide | Your input |
|---|---|---|
| Module and process | Cell layout, current paths and stringer model/settings | |
| Ribbon geometry | Interconnect or busbar role; round diameter or flat width/thickness and tolerances | |
| Material and coating | Base/layer construction, solder alloy, coating thickness and solderable zones | |
| Mechanical handling | Temper/strength targets, camber, spool format and feeding direction | |
| Trial acceptance | Joint-strength method, resistance length/temperature and module check criteria | |
| Comparison record | Current copper baseline, proposed ribbon, test conditions and sample results | |
| Quantity and delivery | Trial/order quantity, packaging, destination and required records |
Copy before opening inquiry.